High-Precision 3D SPI Machine KohYoung KY8030 SMT Solder Paste Inspection
Description
●The KohYoung KY8030-3 is a high-precision 3D SPI machine engineered to deliver accurate, reliable, and repeatable solder paste inspection in advanced SMT production lines. ●Equipped with KohYoung’s industry-leading 3D measurement technology, the KY8030-3 provides precise analysis of solder height, volume, area, and shape—ensuring optimal print quality before component placement. ●Designed for high-speed cycle times and zero-compromise accuracy, the KY8030-3 offers exceptional stability for both high-mix and high-volume electronics manufacturing. ●Its intelligent defect detection algorithms, powerful SPC data management, and seamless SMT line integration make it a critical tool for maintaining soldering quality, reducing downstream defects, and improving overall SMT process performance.
| Brand: | KohYoung | ||
| Model | KY8030-3 | ||
| Resolution | 15um | 20um | 25um |
| Inspection time(per FOV) | 0.47sec | 0.47sec | 0.47sec |
| Machine Size | M | L | XL |
| Max | 330 x 250 mm | 510 x 510 mm | 810 x 610 mm |
| FOV Size | 30 x 30mm | ||
| 3D Inspection Speed | 22.5-56.1cm2/Sec | ||
| Distance between deposit | 100 Micrometer | ||
| Inspection Size | 10 x 10mm | ||
| Inspection Height | 400 Micrometer | ||
| PCB Size Handling | 330 X330mm To 850 x 690mm | ||
| Air And Power Supplies | Single Phase 200-240vac,50-60hz,5kgf/ Cm2 | ||
