SMT Assembly Machine Hanwha SM481 pick and place machine
| Model | Samsung SM481 | ||
| Alignment | Flying Vision + Stage Vision (Option) | ||
| Number of Spindles |
10 Spindles × 1 Gantry | ||
| Placement Speed |
38,000 CPH (Optimum) | ||
| Placement Accuracy |
Chip/QFP | ±50um@u+3σ/Chip,±30um@u+3a/ QFP (Based on the standard chips) |
|
| Component Range |
Flying Vision | FOV 24 | 0402(01005 inch) –□16mm IC, Connector (Lead Pitch 0.4mm) · BGA, CSP (Ball Pitch 0.4mm) |
| Stage Vision (Option) | FOV 35 | ~□16mm IC, Connector (Lead Pitch 0.3mm) •BGA, CSP (Ball Pitch 0.4mm) ~□32mm IC, Connector (Lead Pitch 0.4mm) ·BGA, CSP (Ball Pitch 0.5mm) |
|
| FOV 45 | ~□32mm IC, Connector (Lead Pitch 0.4mm) · BGA, CSP (Ball Pitch 0.5mm) ~□42mm IC. Connector (Lead Pitch 0.5mm) · BGA, CSP (Ball Pitch 1.Omm) |
||
| Max. Height | 10mm (Option:15mm) | ||
| Board Dimension (mm) |
Minimum | 50(L) × 40(W) | |
| Maximum | 460(L) × 400(W) 510(L)× 460(W) (Option) 610(L)×510(W) (Option) 1,500(L)× 460(W) (Option) |
||
| PCB Thickness | 0.38 – 4.2 | ||
| Feeder Capacity | 120ea / 112ea (Docking Cart) | ||
| Utility | Power | AC 200/ 208 / 220 /240 / 380 / 415 V (50/60Hz, 3Phase) Max. 3.5kVA |
|
| Air Consumption | 0.5 – 0.7MPa (5 – 7kgf/cm2) 180Nℓ/min, 50N0/min (Vacuum Pump) |
||
| Mass | Approx. 1,655kg | ||
| External Dimension(mm) | 1,650(L) × 1,680(D) × 1,530(H) | ||
SMT Assembly Machine Hanwha SM481 pick and place machine
| Model | Samsung SM481 | ||
| Alignment | Flying Vision + Stage Vision (Option) | ||
| Number of Spindles |
10 Spindles × 1 Gantry | ||
| Placement Speed |
38,000 CPH (Optimum) | ||
| Placement Accuracy |
Chip/QFP | ±50um@u+3σ/Chip,±30um@u+3a/ QFP (Based on the standard chips) |
|
| Component Range |
Flying Vision | FOV 24 | 0402(01005 inch) –□16mm IC, Connector (Lead Pitch 0.4mm) · BGA, CSP (Ball Pitch 0.4mm) |
| Stage Vision (Option) | FOV 35 | ~□16mm IC, Connector (Lead Pitch 0.3mm) •BGA, CSP (Ball Pitch 0.4mm) ~□32mm IC, Connector (Lead Pitch 0.4mm) ·BGA, CSP (Ball Pitch 0.5mm) |
|
| FOV 45 | ~□32mm IC, Connector (Lead Pitch 0.4mm) · BGA, CSP (Ball Pitch 0.5mm) ~□42mm IC. Connector (Lead Pitch 0.5mm) · BGA, CSP (Ball Pitch 1.Omm) |
||
| Max. Height | 10mm (Option:15mm) | ||
| Board Dimension (mm) |
Minimum | 50(L) × 40(W) | |
| Maximum | 460(L) × 400(W) 510(L)× 460(W) (Option) 610(L)×510(W) (Option) 1,500(L)× 460(W) (Option) |
||
| PCB Thickness | 0.38 – 4.2 | ||
| Feeder Capacity | 120ea / 112ea (Docking Cart) | ||
| Utility | Power | AC 200/ 208 / 220 /240 / 380 / 415 V (50/60Hz, 3Phase) Max. 3.5kVA |
|
| Air Consumption | 0.5 – 0.7MPa (5 – 7kgf/cm2) 180Nℓ/min, 50N0/min (Vacuum Pump) |
||
| Mass | Approx. 1,655kg | ||
| External Dimension(mm) | 1,650(L) × 1,680(D) × 1,530(H) | ||
